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Package Burn In Tester

CEO MESSAGE VISION BIZ AREA HISTORY DF CI LOCATIONS

Wafer Tester Package Burn In Tester

Package Burn In Tester

High speed Memory Tester at Package Level

DF-2200F/2100F

·: The DF-2XXX System is a High-Frequency(200Mhz) Burn In Tester.

·: 200Mhz Speed Test in Burn In Chamber environment to maximize throuth put.

·: Concurrent of two internal models abailable(CI-MCP, eMCP, etc)

·: The System has many channels and can reduce device sharing.

·: High Performane Flexible Zone(Site)

·: Ease of Connection(Low Contact Force).

·: 2 Independence Controlled chambers.

SPECFICATION

ITEM		UNIT		DF-2200F	DF-2100F
SYSTEM	SYSTEM	SITE		PER SITE SYSTEM
	SYSTEM	SPEED		200Mhz
	ITEM OF SIGNAL	I/O CH		384 CH
		ADD.DRV		128 CH
		CLK/SCAN DRV		352 CH
	CPU & MEMORY	CPU		6EA / SLOT	2EA/ SLOT
		FAIL MEMORY		2Gbyte / SLOT	16Gbyte / SLOT
		VECTOR MEMORY		256K x 8 IO
		DBM		32M x 16 IO
		UBM		16K bit / IO
	BURN IN BOARD	SIZE		450mm x 570mm
		ID		YES
		DENSITY		MAX 480 / BIB
	PS	DPS		MAX 216A / SLOT	MAX 288A / SLOT
	TARGET DEVICE	NAND FLASH, DRAM, LPDDR, etc
CHAMBER	CHAMBER	NUMBER OF ZONE		NAND FLASH, DRAM, LPDDR, etc
	TEMP	SLOT PITCH		45mm
		CONTROL		-30℃ ~ 125℃
		RESOLUTION		0.1℃
		ACCURACY		±3℃
		LOAD		3Kw / CHAMBER
	CONTROL	TEMP		AUTO & MANUAL
		DOOR		AUTO TYPE
		BIB INSERT		AUTO TYPE

High Current Memory Tester at Package Level

DF-1610

The DF-1610 series is a high current test system.
The DF-1610 can be installed by modular selection of negative power and positive power.

·: 40Mhz Package Burn In System.

·: Flexible Zone of 32 slot / 2Chamber.

·: Easily replaceable Negative and Positive Power Module.

·: GDDR6 / PCRAM in Burn-In chamber enviroment to maximize throuthput.

·: Number of DPS : 5 Group / Slot

-: Positive Voltage : 46Ch / 568A

-: Negative Voltage : 6Ch / 120A

·: Independently Controlled chambers.

SPECFICATION

ITEM		UNIT		DF-1610
SYSTEM	SYSTEM	SITE		PER SITE SYSTEM
	SYSTEM	SPEED		40Mhz
	ITEM OF SIGNAL	I/O CH		64CH
		ADD.DRV		40CH x 2
		CLK/SCAN DRV		CLK(40CH), SCAN(40CH)
	CPU & MEMORY	CPU		1EA / SLOT
		FAIL MEMORY		32MW / 64 IO
		VECTOR MEMORY		256KB / SLOT
		DBM		32M x 16bit
		UBM		-
	CPU & MEMORY	SIZE		450mm x 570mm
		ID		YES
		DENSITY		MAX 480 / BIB
	PS	DPS		MAX 520A / SITE (NORMAL : 400A + Opt : 120A )
	TARGET DEVICE	GDDR6, PCRAM, DRAM, FLASH, etc
CHAMBER	CHAMBER	NUMBER OF ZONE		2CHAMBER, 32SLOT (16SLOT / 1CHAMBER)
	TEMP	SLOT PITCH		45mm
		CONTROL		50℃ ~ 125℃
		RESOLUTION		0.1℃
		ACCURACY		±4℃
		LOAD		5Kw / CHAMBER
	CONTROL	TEMP		AUTO & MANUAL
		DOOR		AUTO TYPE
		BIB INSERT		AUTO TYPE

Memory Burn In System at Package Level

DF-1540 /1550

DF-15XX Serise System Is Compatible with JEC Co. System and BIB.

·: 33Mhz Package Burn In System.

·: 4 Zone of 32 Slot / 1Chamber.

·: Max CPU : 4 Zone + 1 Master.

·: Number of PS : 3 or 5 Group / Slot.

-: Max : 55A / 118A.

·: Channel between System and BIB : 86Pin + 100Pin + 86Pin

SPECFICATION

ITEM		UNIT		DF-1540	DF-1550
SYSTEM	SYSTEM	ZONE		4	4
	SYSTEM	SPEED		33Mhz	33Mhz
	ITEM OF SIGNAL	I/O CH		72CH / SLOT	72CH / SLOT
		ADD.DRV		32CH x 2 / SLOT	32CH x 2 / SLOT
		CLK/SCAN DRV		CLK(16), SCAN(32)	CLK(16), SCAN(32)
		CPU		1EA / ZONE	1EA / ZONE
	CPU & MEMORY	FAIL MEMORY		256D x 64bit	256D x 64bit
		VECTOR MEMORY		256K x 16bit	256K x 16bit
		SIZE		450mm x 570mm	450mm x 570mm
	BURN IN BOARD	ID		YES	YES
		DENSITY		MAX 480 / BIB	MAX 480 / BIB
	PS	DPS		MAX 55A / SLOT	MAX 118A / SLOT
	TARGET DEVICE	NAND FLASH, DRAM, LPDDR, etc
CHAMBER	CHAMBER	NUMBER OF ZONE		32SLOT / 1CHAMBER	32SLOT / 1CHAMBER
	CHAMBER	SLOT PITCH		45mm	45mm
	TEMP	CONTROL		60℃ ~ 125℃	40℃ ~ 125℃
		RESOLUTION		0.1℃	0.1℃
		ACCURACY		±3℃	±4℃
		LOAD		3Kw / CHAMBER	4Kw / CHAMBER
	CONTROL	TEMP		AUTO & MANUAL	AUTO & MANUAL
		DOOR		AUTO TYPE	AUTO TYPE
		BIB INSERT		AUTO TYPE	AUTO TYPE

Memory Burn In System at Package Level

DF-1560

DF-15XX Serise System Is Compatible with A Co. System and BIB.

·: 33Mhz Package Burn In System.

·: Flexible of 32 Slot / 2Chamber / Hot & Cold.

·: Max CPU : 32ea

·: Number of DPS : 5 Group / Slot. Or 25A 8EA / 18A 3EA

-: Max : 125A / 254A.

·: Channle between System and BIB : 100Pin + 100Pin + 100Pin

SPECFICATION

ITEM		UNIT		DF-1540
SYSTEM	SYSTEM	SITE		PER SITE SYSTEM
	SYSTEM	SPEED		33Mhz
	ITEM OF SIGNAL	I/O CH		64CH / SLOT
		ADD.DRV		32CH x 2 / SLOT
		CLK/SCAN DRV		CLK(16), SCAN(32)
	CPU & MEMORY	CPU		32EA / SLOT
		FAIL MEMORY		32M / IO
		VECTOR MEMORY		-
		DBM		32M x 64 IO
		UBM		16K / IO
	BURN IN BOARD	SIZE		450mm x 570mm
		ID		YES
		DENSITY		MAX 480 / BIB
	PS	DPS		MAX 254A / SLOT
	TARGET DEVICE	NAND FLASH, DRAM, LPDDR, etc
CHAMBER	CHAMBER	NUMBER OF ZONE		2CHAMBER, 48SLOT (24SLOT / 1CHAMBER)
		SLOT PITCH		40mm
		CONTROL		50 ~ 125℃
		RESOLUTION		0.1℃
	TEMP	ACCURACY		±4℃
	TEMP	LOAD		5Kw / CHAMBER
	CONTROL	TEMP		AUTO & MANUAL
		DOOR		AUTO TYPE
		BIB INSERT		AUTO TYPE