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Package Burn In Tester
대표이사 인사말 경영이념 사업영역 연혁 조직도/CI 오시는길
Wafer Tester Package Burn In Tester

Package Burn In Tester

High speed Memory Tester at Package Level

DF-2200F/2100F

· 
The DF-2XXX System is a High-Frequency(200Mhz) Burn In Tester.
· 
200Mhz Speed Test in Burn In Chamber environment to maximize throuth put.
· 
Concurrent of two internal models abailable(CI-MCP, eMCP, etc)
· 
The System has many channels and can reduce device sharing.
· 
High Performane Flexible Zone(Site)
· 
Ease of Connection(Low Contact Force).
· 
2 Independence Controlled chambers.

SPECFICATION

ITEM UNIT DF-2200F DF-2100F
SYSTEM SYSTEM SITE PER SITE SYSTEM
SPEED 200Mhz
ITEM OF SIGNAL I/O CH 384 CH
ADD.DRV 128 CH
CLK/SCAN DRV 352 CH
CPU & MEMORY CPU 6EA / SLOT 2EA/ SLOT
FAIL MEMORY 2Gbyte / SLOT 16Gbyte / SLOT
VECTOR MEMORY 256K x 8 IO
DBM 32M x 16 IO
UBM 16K bit / IO
BURN IN BOARD SIZE 450mm x 570mm
ID YES
DENSITY MAX 480 / BIB
PS DPS MAX 216A / SLOT MAX 288A / SLOT
TARGET DEVICE NAND FLASH, DRAM, LPDDR, etc
CHAMBER CHAMBER NUMBER OF ZONE NAND FLASH, DRAM, LPDDR, etc
TEMP SLOT PITCH 45mm
CONTROL -30℃ ~ 125℃
RESOLUTION 0.1℃
ACCURACY ±3℃
LOAD 3Kw / CHAMBER
CONTROL TEMP AUTO & MANUAL
DOOR AUTO TYPE
BIB INSERT AUTO TYPE

High Current Memory Tester at Package Level

DF-1610

The DF-1610 series is a high current test system.
The DF-1610 can be installed by modular selection of negative power and positive power.

· 
40Mhz Package Burn In System.
· 
Flexible Zone of 32 slot / 2Chamber.
· 
Easily replaceable Negative and Positive Power Module.
· 
GDDR6 / PCRAM in Burn-In chamber enviroment to maximize throuthput.
· 
Number of DPS : 5 Group / Slot
  - 
Positive Voltage : 46Ch / 568A
  - 
Negative Voltage : 6Ch / 120A
· 
Independently Controlled chambers.

SPECFICATION

ITEM UNIT DF-1610
SYSTEM SYSTEM SITE PER SITE SYSTEM
SPEED 40Mhz
ITEM OF SIGNAL I/O CH 64CH
ADD.DRV 40CH x 2
CLK/SCAN DRV CLK(40CH), SCAN(40CH)
CPU & MEMORY CPU 1EA / SLOT
FAIL MEMORY 32MW / 64 IO
VECTOR MEMORY 256KB / SLOT
DBM 32M x 16bit
UBM -
CPU & MEMORY SIZE 450mm x 570mm
ID YES
DENSITY MAX 480 / BIB
PS DPS MAX 520A / SITE (NORMAL : 400A + Opt : 120A )
TARGET DEVICE GDDR6, PCRAM, DRAM, FLASH, etc
CHAMBER CHAMBER NUMBER OF ZONE 2CHAMBER, 32SLOT (16SLOT / 1CHAMBER)
TEMP SLOT PITCH 45mm
CONTROL 50℃ ~ 125℃
RESOLUTION 0.1℃
ACCURACY ±4℃
LOAD 5Kw / CHAMBER
CONTROL TEMP AUTO & MANUAL
DOOR AUTO TYPE
BIB INSERT AUTO TYPE

Memory Burn In System at Package Level

DF-1540 /1550

DF-15XX Serise System Is Compatible with JEC Co. System and BIB.

· 
33Mhz Package Burn In System.
· 
4 Zone of 32 Slot / 1Chamber.
· 
Max CPU : 4 Zone + 1 Master.
· 
Number of PS : 3 or 5 Group / Slot.
  - 
Max : 55A / 118A.
· 
Channel between System and BIB : 86Pin + 100Pin + 86Pin

SPECFICATION

ITEM UNIT DF-1540 DF-1550
SYSTEM SYSTEM ZONE 4 4
SPEED 33Mhz 33Mhz
ITEM OF SIGNAL I/O CH 72CH / SLOT 72CH / SLOT
ADD.DRV 32CH x 2 / SLOT 32CH x 2 / SLOT
CLK/SCAN DRV CLK(16), SCAN(32) CLK(16), SCAN(32)
CPU 1EA / ZONE 1EA / ZONE
CPU & MEMORY FAIL MEMORY 256D x 64bit 256D x 64bit
VECTOR MEMORY 256K x 16bit 256K x 16bit
SIZE 450mm x 570mm 450mm x 570mm
BURN IN BOARD ID YES YES
DENSITY MAX 480 / BIB MAX 480 / BIB
PS DPS MAX 55A / SLOT MAX 118A / SLOT
TARGET DEVICE NAND FLASH, DRAM, LPDDR, etc
CHAMBER CHAMBER NUMBER OF ZONE 32SLOT / 1CHAMBER 32SLOT / 1CHAMBER
SLOT PITCH 45mm 45mm
TEMP CONTROL 60℃ ~ 125℃ 40℃ ~ 125℃
RESOLUTION 0.1℃ 0.1℃
ACCURACY ±3℃ ±4℃
LOAD 3Kw / CHAMBER 4Kw / CHAMBER
CONTROL TEMP AUTO & MANUAL AUTO & MANUAL
DOOR AUTO TYPE AUTO TYPE
BIB INSERT AUTO TYPE AUTO TYPE

Memory Burn In System at Package Level

DF-1560

DF-15XX Serise System Is Compatible with A Co. System and BIB.

· 
33Mhz Package Burn In System.
· 
Flexible of 32 Slot / 2Chamber / Hot & Cold.
· 
Max CPU : 32ea
· 
Number of DPS : 5 Group / Slot. Or 25A 8EA / 18A 3EA
- 
Max : 125A / 254A.
· 
Channle between System and BIB : 100Pin + 100Pin + 100Pin

SPECFICATION

ITEM UNIT DF-1540
SYSTEM SYSTEM SITE PER SITE SYSTEM
SPEED 33Mhz
ITEM OF SIGNAL I/O CH 64CH / SLOT
ADD.DRV 32CH x 2 / SLOT
CLK/SCAN DRV CLK(16), SCAN(32)
CPU & MEMORY CPU 32EA / SLOT
FAIL MEMORY 32M / IO
VECTOR MEMORY -
DBM 32M x 64 IO
UBM 16K / IO
BURN IN BOARD SIZE 450mm x 570mm
ID YES
DENSITY MAX 480 / BIB
PS DPS MAX 254A / SLOT
TARGET DEVICE NAND FLASH, DRAM, LPDDR, etc
CHAMBER CHAMBER NUMBER OF ZONE 2CHAMBER, 48SLOT (24SLOT / 1CHAMBER)
SLOT PITCH 40mm
CONTROL 50 ~ 125℃
RESOLUTION 0.1℃
TEMP ACCURACY ±4℃
LOAD 5Kw / CHAMBER
CONTROL TEMP AUTO & MANUAL
DOOR AUTO TYPE
BIB INSERT AUTO TYPE