PRODUCTS

Wafer Tester

Memory Tester at Wafer Level

DF-5200(HBM3E)

SPECFICATION

UNIT ITEM DF-5200
CPU Q'ty 96
FLASH 128Mbyte
RAM 8Gbyte
TG SPEED 220Mhz
TEST RATE 4.5ns
RESOLUTION 78ps
PG PATTERN LENTH 8K
USER MEMORY UBM 32K/IO
DBM 4M/72bit
FAIL MEMORY FM SERVER(512GB) x 4
RA MEMORY
DPS CURRENT 1.4A / 2560
PROBE CARD SIZE 520 Pi
DUT PARALLEL 3072
CHANNEL IO 6144
DRV 2816
L-DRV 2944
TARGET DEVICE DDR,LPDDR,HBM

In development

Memory Tester & Burn In Systems at Wafer Level

DF-8000/8100/8400

The DF-8000/8100/8400 and DF Series Memory Wafer test & Burn In Systems,
are designed to provide full function wafer Test and Burn In solution.
with its 40Mhz/10Mhz frequency.

SPECFICATION

UNIT ITEM DF-8000 DF-8100 DF-8400
CPU Qty - 28ea 36ea
FLASH 8GByte
RAM 1GByte
TEST HEAD COUNT 2 1 1
TG SPEED 10Mhz 10Mhz 40Mhz
TEST RATE 100ns ~ 40.96㎲ 25ns ~ 10ms 25ns ~ 10ms
RESOLUTION 10ns 1ns 1ns
PG PATTERN LENTH 512 2K
USER MEMORY UBM - 16Kbit / IO
DBM - 32Mbyte 16Mbyte
FAIL MEMORY - 144Gbit/Sys 224Gbit/Sys
RA MEMORY - 144Gbit/Sys 224Gbit/Sys
DPS CURRENT TYPE 800mA
PROBE CARD SIZE 440pi POGO 480pi ZIF 440pi ZIF
DUT PARALLEL 228 224 288
CHANNEL IO 2304 1792 1792
DRV 576 2016 2016
HC DRV 576 224 224
HV DRV - 896 896
HC/HV 576 - -
R/B - 224 224
POWER DPS - 448 288
TARGET DEVICE DRAM , SRAM, FLASH(NAND, NOR) DRAM, NAND FLASH

Memory Tester at Wafer Level

DF-8600

The DF-8600 and DF Memory Test Systems are designed to provide full functional wafer
testing soultion.With its 100Mhz high speed testing frequency,users can get several
adavntages.

SPECFICATION

UNIT ITEM DF-8600 (36SITE)
CPU Qty 5EA / 1SITE x 36SITE = 180EA
FLASH 8GByte
RAM 1GByte
TG SPEED 100Mhz
TEST RATE 10ns ~ 5ms
RESOLUTION 200ps
PG PATTERN LENTH 4K
USER MEMORY UBM 16Kbit / IO
DBM 64MByte
FAIL MEMORY 2,304Gbit / SYSTEM
RA MEMORY 2,304Gbit / SYSTEM
DPS CURRENT TYPE 1.2A or 400mA
PROBE CARD SIZE 440, 480, 520pi FLEXIBLE
DUT PARALLEL 1152
CHANNEL IO 4608
DRV 576
HV DRV 120mA : 288EA or 15mA : 2,304EA
POWER DRAM, NAND FLASH, etc
Designed by 홈페이지제작.kr